Title :
RFIC packaging and test: How will we cut costs?
Author_Institution :
Cascade Microtech, Inc., United States
Abstract :
The current state of the art and trends in packaging and engineering and production testing of RFICs are surveyed. Existing and new strategies for long-range improvements in RFIC packaging and testing costs are compared. Increasing integration levels, chip-scale packaging, earlier testing, and parallel testing will be future themes in RFIC assembly and test.
Keywords :
Circuit testing; Costs; Integrated circuit modeling; Integrated circuit testing; Packaging machines; Probes; Production; Productivity; Radio frequency; Radiofrequency integrated circuits;
Conference_Titel :
Solid-State Circuits Conference, 1998. ESSCIRC '98. Proceedings of the 24th European
DOI :
10.1109/ESSCIR.1998.186206
