BiCMOS differential temperature sensor: Characterization and BIST applications

Measurements of thermal gradients inside the silicon die can be used for BIST applications. Two temperature sensors sensible to changes of the surface thermal gradient have been implemented in a 1.2 µm BiCMOS technology. Results show that the power dissipated by a circuit can be monitored by placing differential temperature sensors. A detailed analysis of the noise coupled to the sensor in a mixed signal circuit environment is performed.