DocumentCode
439742
Title
Wire self-heating in supply lines on bulk-CMOS ICs
Author
Veendrick, H.
Author_Institution
Philips Research Laboratories, Eindhoven, The Netherlands
fYear
2002
fDate
24-26 Sept. 2002
Firstpage
199
Lastpage
202
Abstract
In contradiction with existing literature [1-4], the temperature rise caused by wire self-heating in bulk-CMOS technologies with aluminium back-end as well as with copper and low-k dielectrics is shown to be negligible. When common design practices are applied, the elecromigration and voltage drop requirements limit this temperature rise to only a few degrees.
Keywords
CMOS technology; Copper; Current density; Electromigration; Heating; Integrated circuit interconnections; Power dissipation; Temperature; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2002. ESSCIRC 2002. Proceedings of the 28th European
Conference_Location
Florence, Italy
Type
conf
Filename
1471500
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