• DocumentCode
    440208
  • Title

    Advanced Flip Chip Technologies

  • Author

    Oppermann, H. Hermann ; Aschenbrenner, Rolf ; Reichl, Herbert

  • Author_Institution
    FhG IZM, Germany
  • Volume
    1
  • fYear
    1999
  • fDate
    13-15 Sept. 1999
  • Firstpage
    64
  • Lastpage
    71
  • Keywords
    Bonding; Costs; Electronic packaging thermal management; Electronics packaging; Flip chip; Frequency; Inorganic materials; Joining materials; Power system reliability; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 1999. Proceeding of the 29th European
  • Conference_Location
    Leuven, Belgium
  • Print_ISBN
    2-86332-245-1
  • Type

    conf

  • Filename
    1505450
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=440208