440236

Measurements of Mechanical Stress Drift in IC Plastic Packages using the Piezo-Hall Effect

Manic, D. ; Popovi, R.S. ; Petr, J.

Swiss Federal Institute of Technology, Lausanne, Switzerland

1

1999

13-15 Sept. 1999

256

259

Mechanical variables measurement; Piezoresistance; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device measurement; Silicon; Stress measurement; Temperature measurement; Temperature sensors; Thermal stresses;

English

ieee

Solid-State Device Research Conference, 1999. Proceeding of the 29th European

Leuven, Belgium

2-86332-245-1

conf

1505488