• DocumentCode
    440236
  • Title

    Measurements of Mechanical Stress Drift in IC Plastic Packages using the Piezo-Hall Effect

  • Author

    Manic, D. ; Popovi, R.S. ; Petr, J.

  • Author_Institution
    Swiss Federal Institute of Technology, Lausanne, Switzerland
  • Volume
    1
  • fYear
    1999
  • fDate
    13-15 Sept. 1999
  • Firstpage
    256
  • Lastpage
    259
  • Keywords
    Mechanical variables measurement; Piezoresistance; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device measurement; Silicon; Stress measurement; Temperature measurement; Temperature sensors; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference, 1999. Proceeding of the 29th European
  • Conference_Location
    Leuven, Belgium
  • Print_ISBN
    2-86332-245-1
  • Type

    conf

  • Filename
    1505488
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=440236