• DocumentCode
    44719
  • Title

    Experimental Characterization of Frequency-Dependent Series Resistance and Inductance for Ground Shielded On-Chip Interconnects

  • Author

    Cortes-Hernandez, Diego M. ; Torres-Torres, R. ; Gonzalez-Diaz, Oscar ; Linares-Aranda, Monico

  • Author_Institution
    Dept. of Electron., Inst. Nac. de Astrofis., Opt. y Electron., Tonanzintla, Mexico
  • Volume
    56
  • Issue
    6
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1567
  • Lastpage
    1575
  • Abstract
    This paper presents an exhaustive analysis of the frequency-dependent series resistance and inductance associated with the distributed model of on-chip interconnects including a ground shield to reduce substrate losses. This analysis identifies the regions where the resistance and inductance curves present different trending due to variations in the current distribution. Furthermore, the apparent discrepancy of experimental curves with the well-known square-root-of-frequency models for the resistance and inductance considering the skin-effect is explained. Measurement results up to 40 GHz show that models involving terms proportional to the square root of frequency are valid provided that the section of the interconnect where the current is flowing is appropriately represented.
  • Keywords
    current distribution; electromagnetic shielding; integrated circuit interconnections; integrated circuit modelling; skin effect; IC interconnects; current distribution; distributed model; frequency-dependent series inductance; frequency-dependent series resistance; ground shielded on-chip interconnects; inductance curves; resistance curves; skin-effect; square-root-of-frequency models; substrate losses reduction; Current distribution; Inductance; Integrated circuit interconnections; Metals; Resistance; Skin effect; IC interconnects; ground shield; skin effect;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2014.2321580
  • Filename
    6828731