DocumentCode
450848
Title
The future of silicon design
Author
Makimoto, Tsugio
Author_Institution
Sony, Tokyo
fYear
2005
fDate
14-15 Sept. 2005
Abstract
A collection of slides from the author´s conference presentation is given.
Keywords
integrated circuit design; silicon; system-in-package; system-on-chip; technological forecasting; microelectronics; silicon design; system-in-package; system-on-chip;
fLanguage
English
Publisher
iet
Conference_Titel
Commercialising Technology and Innovation, 2005. The First IEE International Conference on (Ref. No. 2005/11044)
Conference_Location
London
ISSN
0537-9989
Print_ISBN
0-86341-561-X
Type
conf
Filename
1588655
Link To Document