Title :
Effects of External Temperature on Therapeutic Heating with Interstitial Instrumentation
Author :
Jarosz, Boguslaw J.
Author_Institution :
Ottawa-Carleton Inst. for Phys., Carleton Univ., Ottawa, Ont.
Abstract :
Use of interstitial instrumentation for therapeutic heating is often compromised by uncontrollable thermal washout caused by stochastically distributed heat sinks. The heat sinks effects may be mitigated by, among others, control of the external temperature during the heating. For these procedures temporal characterization becomes crucial. We propose transient FEA simulations as a reliable method of modeling the temporal behavior at different external temperatures. Heating curves obtained in measurements of ultrasonic heating in a brain phantom are modeled using the simulations. On achieving good agreement between the simulation and experimental results, we proceeded with the simulation of heating in a complex head model. Heating efficacy is described in terms of extent and volume of thermal dose. The extent and the volume increased by 40 to 100% for the temperatures of 18 to 470C. We found that there is monotonic but nonlinear dependence between the extent and the volume of the thermal dose on external temperature
Keywords :
biological effects of ultraviolet radiation; biomedical ultrasonics; biothermics; brain; finite element analysis; phantoms; radiation therapy; ultrasonic equipment; 18 to 470 C; brain phantom; head model; heat sink effects; interstitial instrumentation; medical instrumentation; temperature measurement; therapeutic heating; thermal dose; transient FEA simulation; ultrasonic heating; uncontrollable thermal washout; Applicators; Brain modeling; Field emitter arrays; Heat sinks; Heat transfer; Heating; Imaging phantoms; Instruments; Temperature control; Ultrasonic variables measurement; FEA simulations; head model; interstitial instrumentation; medical instrumentation; temperature measurement; ultrasonic heating;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2005. IMTC 2005. Proceedings of the IEEE
Conference_Location :
Ottawa, Ont.
Print_ISBN :
0-7803-8879-8
DOI :
10.1109/IMTC.2005.1604142