Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges

Author

Yin, Wen-Yan ; Dong, X.T. ; Mao, Junfa

Author_Institution

Sch. of Electron. Inf. & Electr. Eng., Shanghai Jiao Tong Univ., China

Volume

2

fYear

2005

fDate

4-7 Dec. 2005

Abstract

Various finite-ground thin-film microstrip interconnects (TFMIs) used in the design of high-speed circuit, monolithic microwave and millimeter-wave integrated circuits are studied and compared. Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground TFMIs on benzocyclobutene (BCB), polyimide and LTCC films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc.

Keywords

ceramics; dielectric thin films; integrated circuit interconnections; microstrip lines; LTCC films; benzocyclobutene films; finite-ground thin-film microstrip interconnects; high-speed circuit; millimeter-wave integrated circuits; monolithic microwave circuits; polyimide films; power handling capabilities; thermal model; Frequency; Integrated circuit interconnections; Metallization; Microstrip; Millimeter wave integrated circuits; Polyimides; Temperature distribution; Thermal conductivity; Thin film circuits; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings

Print_ISBN

0-7803-9433-X

Type

conf

DOI

10.1109/APMC.2005.1606428

Filename

1606428