DocumentCode :
45515
Title :
Simulation of Low-Pressure Capacitively Coupled Plasmas Combining a Parallelized Particle-in-Cell Simulation and Direct Simulation of Monte Carlo
Author :
Jin Seok Kim ; Min Young Hur ; In Cheol Song ; Ho-Jun Lee ; Hae June Lee
Author_Institution :
Dept. of Electr. & Comput. Eng., Pusan Nat. Univ., Busan, South Korea
Volume :
42
Issue :
12
fYear :
2014
fDate :
Dec. 2014
Firstpage :
3819
Lastpage :
3824
Abstract :
A parallelized particle-in-cell (PIC) simulation and direct simulation of Monte Carlo (DSMC) are combined to simulate low-pressure discharges. A two-dimensional (2-D) PIC simulation parallelized with graphics processing units is used to examine the discharge characteristics of a capacitively coupled plasma device at pressures <; 10 mTorr, whereas a DSMC method is used to calculate the neutral distribution instead of a fluid model. The neutral distribution profile is transferred to the PIC simulation as the initial condition. At low gas pressures, the neutral density profile shows nonuniform properties, which also changes the simulation results of plasma uniformity. Overall, the inclusion of an accurate neutral density profile is essential for obtaining exact simulation results that are comparable with the experimental results.
Keywords :
Monte Carlo methods; high-frequency discharges; plasma simulation; Monte Carlo simulation; capacitively coupled plasma device; direct simulation; discharge characteristics; gas pressures; graphics processing units; low-pressure capacitively coupled plasmas; neutral density profile; neutral distribution profile; parallelized particle-in-cell simulation; plasma uniformity; two-dimensional PIC simulation; Computational modeling; Discharges (electric); Mathematical model; Monte Carlo methods; Plasma temperature; Semiconductor process modeling; Capacitively coupled plasmas (CCPs); direct simulation of Monte Carlo (DSMC); particle-in-cell (PIC); particle-in-cell (PIC).;
fLanguage :
English
Journal_Title :
Plasma Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-3813
Type :
jour
DOI :
10.1109/TPS.2014.2368145
Filename :
6960097
Link To Document :
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