DocumentCode
45660
Title
CMOS Small-Signal and Thermal Noise Modeling at High Frequencies
Author
Antonopoulos, Antonios ; Bucher, Matthias ; Papathanasiou, Kostas ; Mavredakis, N. ; Makris, Nikos ; Sharma, Ratnesh K. ; Sakalas, Paulius ; Schroter, Michael
Author_Institution
Sch. of Electron. & Comput. Eng., Tech. Univ. of Crete, Chania, Greece
Volume
60
Issue
11
fYear
2013
fDate
Nov. 2013
Firstpage
3726
Lastpage
3733
Abstract
In this paper, the behavior of radio frequency (RF) CMOS noise up to 24 GHz is analyzed and verified with measurements over a wide range of bias voltages and channel lengths. For the first time, approaches for excess noise factor modeling are validated versus measurements. Furthermore, important RF CMOS figures of merit are examined over many CMOS generations. With the scaling of CMOS technology, optimum RF performance is shown to be shifted from higher moderate toward lower moderate inversion, providing important guidelines for RFIC design. The results are validated with the charge-based EKV3 compact model, which considers short-channel effects such as channel length modulation, velocity saturation, and carrier heating.
Keywords
CMOS integrated circuits; field effect MMIC; integrated circuit modelling; integrated circuit noise; CMOS small-signal modeling; CMOS thermal noise modeling; RF CMOS figures of merit; RFIC design; bias voltages; carrier heating; channel length modulation; channel lengths; charge-based EKV3 compact model; excess noise factor modeling; high frequencies; optimum RF performance; radio frequency CMOS noise; short-channel effects; velocity saturation; CMOS integrated circuits; Logic gates; Noise; Noise measurement; Radio frequency; Semiconductor device modeling; Thermal noise; Compact model; high-frequency (HF) noise; induced gate noise; metal–oxide–semiconductor field-effect transistor (MOSFET); millimeter wave; moderate inversion (MI); radio frequency (RF); scaling; technology computer aided design (TCAD);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2283511
Filename
6626610
Link To Document