• DocumentCode
    45660
  • Title

    CMOS Small-Signal and Thermal Noise Modeling at High Frequencies

  • Author

    Antonopoulos, Antonios ; Bucher, Matthias ; Papathanasiou, Kostas ; Mavredakis, N. ; Makris, Nikos ; Sharma, Ratnesh K. ; Sakalas, Paulius ; Schroter, Michael

  • Author_Institution
    Sch. of Electron. & Comput. Eng., Tech. Univ. of Crete, Chania, Greece
  • Volume
    60
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    3726
  • Lastpage
    3733
  • Abstract
    In this paper, the behavior of radio frequency (RF) CMOS noise up to 24 GHz is analyzed and verified with measurements over a wide range of bias voltages and channel lengths. For the first time, approaches for excess noise factor modeling are validated versus measurements. Furthermore, important RF CMOS figures of merit are examined over many CMOS generations. With the scaling of CMOS technology, optimum RF performance is shown to be shifted from higher moderate toward lower moderate inversion, providing important guidelines for RFIC design. The results are validated with the charge-based EKV3 compact model, which considers short-channel effects such as channel length modulation, velocity saturation, and carrier heating.
  • Keywords
    CMOS integrated circuits; field effect MMIC; integrated circuit modelling; integrated circuit noise; CMOS small-signal modeling; CMOS thermal noise modeling; RF CMOS figures of merit; RFIC design; bias voltages; carrier heating; channel length modulation; channel lengths; charge-based EKV3 compact model; excess noise factor modeling; high frequencies; optimum RF performance; radio frequency CMOS noise; short-channel effects; velocity saturation; CMOS integrated circuits; Logic gates; Noise; Noise measurement; Radio frequency; Semiconductor device modeling; Thermal noise; Compact model; high-frequency (HF) noise; induced gate noise; metal–oxide–semiconductor field-effect transistor (MOSFET); millimeter wave; moderate inversion (MI); radio frequency (RF); scaling; technology computer aided design (TCAD);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2283511
  • Filename
    6626610