• DocumentCode
    4568
  • Title

    Nonuniform Multiconductor Transmission Line Analysis by a Two-Step Perturbation Technique

  • Author

    Chernobryvko, Mykola ; De Zutter, Daniel ; Ginste, Dries Vande

  • Author_Institution
    Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
  • Volume
    4
  • Issue
    11
  • fYear
    2014
  • fDate
    Nov. 2014
  • Firstpage
    1838
  • Lastpage
    1846
  • Abstract
    A two-step perturbation technique to model nonuniform multiconductor transmission lines in the frequency domain is presented. In this method, nonuniformities are treated as perturbations with respect to the nominal uniform multiconductor line. Starting from the Telegrapher´s equations and applying two consecutive perturbations steps, at each step, we obtain second-order ordinary differential equations with distributed source terms. Solving these equations together with the appropriate boundary conditions provides the sought-for voltages and currents along the interconnect structure. The method is validated by means of a frequency domain analysis of a ten-conductor microstrip line with random uniformities, confirming its accuracy and efficiency. Additionally, the time-domain accuracy and efficiency is demonstrated by means of a high-speed packaging nonuniform interconnect with six signal conductors.
  • Keywords
    conductors (electric); differential equations; frequency-domain analysis; microstrip lines; time-domain analysis; transmission lines; conductor microstrip line; frequency domain; frequency domain analysis; nonuniform multiconductor transmission line analysis; second-order ordinary differential equations; signal conductors; time-domain accuracy; two-step perturbation technique; Accuracy; Conductors; Frequency-domain analysis; Mathematical model; Perturbation methods; Transmission line matrix methods; Vectors; Interconnect modeling; Telegrapher's equations; Telegrapher???s equations; nonuniform multiconductor transmission line (NMTL); perturbation; transient analysis; transient analysis.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2360312
  • Filename
    6930799