DocumentCode :
45729
Title :
Dual SOA-MZI Wavelength Converters Based on III-V Hybrid Integration on a \\mu{\\rm m} -Scale Si Platform
Author :
Fitsios, D. ; Alexoudi, T. ; Kanellos, G.T. ; Vyrsokinos, K. ; Pleros, N. ; Tekin, Tolga ; Cherchi, Matteo ; Ylinen, Sami ; Harjanne, Mikko ; Kapulainen, Markku ; Aalto, Timo
Author_Institution :
Dept. of Inf., Aristotle Univ. of Thessaloniki, Thessaloniki, Greece
Volume :
26
Issue :
6
fYear :
2014
fDate :
15-Mar-14
Firstpage :
560
Lastpage :
563
Abstract :
We report on the simultaneous wavelength conversion operation of a dual-element semiconductor optical amplifier-Mach-Zehnder interferometer (SOA-MZI) array hybridly integrated on a 4-μm silicon-on-insulator (SOI) waveguide platform through thermocompression bonding. The SOAs are part of a six-element SOA array with both facets coupled on SOI through vertical and horizontal alignments. The device achieves almost two orders of magnitude reduction in footprint compared with state-of-the-art hybridly integrated SOA-MZI structures. We present for the first time experimental proof of the successful operation of a dual-element SOA-MZI device based on III-V technology on SoI that serves as a wavelength converter, with one SOA-MZI yielding error-free performance with a 0.8-dB power penalty at 12.5 Gb/s and the second SOA-MZI operating error-free at 10 Gb/s with a 2-dB power penalty.
Keywords :
III-V semiconductors; Mach-Zehnder interferometers; integrated optoelectronics; lead bonding; optical waveguides; optical wavelength conversion; semiconductor laser arrays; semiconductor optical amplifiers; silicon-on-insulator; μm-scale Si platform; III-V hybrid integration; III-V technology; Si; bit rate 10 Gbit/s; bit rate 12.5 Gbit/s; dual SOA-MZI wavelength converters; dual-element SOA-MZI device; dual-element semiconductor optical amplifier-Mach-Zehnder interferometer array; error-free performance; horizontal alignments; power penalty; silicon-on-insulator waveguide platform; six-element SOA array; size 4 mum; thermocompression bonding; vertical alignments; wavelength conversion operation; Arrays; Bonding; Optical waveguides; Optical wavelength conversion; Photonics; Semiconductor optical amplifiers; Silicon-on-insulator; Mach–Zehnder interferometer; dual-facet coupling; hybrid integration; semiconductor optical amplifier; thermocompression bonding; wavelength conversion;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2013.2297404
Filename :
6701128
Link To Document :
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