Influence of the Thermal Treatment During the Saw Damage Etching Process on the Mechanical Stability of Multicrystalline Silicon Wafers

Author

Borchert, D. ; Riepe, S. ; Kubler, R. ; Beinert, J. ; Kraft, T. ; Kleer, G. ; Petri, S.

Author_Institution

Fraunhofer-Inst. for Solar Energy Syst., Freiburg

Volume

1

fYear

2006

fDate

38838

Firstpage

1085

Lastpage

1087

Abstract

The influence of the thermal treatment during the saw damage etching process on the mechanical stability of multicrystalline silicon wafers has been investigated for four different alkaline saw damage etching procedures. After the different etching procedures the mechanical stabilities of the multicrystalline wafers have been measured using the concentric ring test and the four-point-bending test. The experimental results are compared to those obtained by numerical simulations

Keywords

elemental semiconductors; etching; heat treatment; mechanical stability; silicon; solar cells; Si; concentric ring test; four-point-bending test; mechanical stability; multicrystalline silicon wafers; numerical simulations; saw damage etching process; thermal treatment; Costs; Etching; Photovoltaic cells; Production; Silicon; Temperature; Testing; Thermal stability; Thermal stresses; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on

Conference_Location

Waikoloa, HI

Print_ISBN

1-4244-0017-1

Electronic_ISBN

1-4244-0017-1

Type

conf

DOI

10.1109/WCPEC.2006.279330

Filename

4059821