Status of Leadfree Automotive Electronics

Author

Lange, P. ; Herenz, A. ; Laker, O. ; Schall, E. ; Seubert, T.

Author_Institution

Hella KGaA Hueck & Co., Lippstadt

Volume

1

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

161

Lastpage

168

Abstract

Hella experiences in lead-free production and product applications over more than 10 years show that the lead-free soldering technology is not an easy drop in solution for the existing leaded soldering standards. The new solder process shows lower ability and higher thermal risk to the components. Solder joint reliability values are higher tolerance caused by complex metallization effects and worster wetting. The field of automotive electronics would be well advised to wait for the experiences and optimizations made in nonautomotive areas this time and in the next years (regarding ROHS) to approach the new technology with optimized lead-free designs and a mature supplier market

Keywords

RoHS compliance; automotive electronics; metallisation; reliability; soldering; wetting; Hella experiences; ROHS; complex metallization; lead-free automotive electronic; lead-free production; lead-free soldering; optimizations; solder joint reliability; thermal component risk; worster wetting; Automotive electronics; Consumer electronics; Costs; Design optimization; Electronic equipment testing; Lead; Production; Safety; Soldering; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.279994

Filename

4060718