DocumentCode :
460256
Title :
Growth of Grains Effect on Boron Diffusion in Heavily Implanted Polysilicon Thin Films
Author :
Abadli, Salah ; Mansour, Farida
Author_Institution :
Dept. of Electron., Univ. Hassiba Benbouali of Chief
Volume :
1
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
319
Lastpage :
323
Abstract :
A one-dimensional tow stream diffusion model adapted to the granular structure of polysilicon and to the effects of the strong concentrations has been developed. This model includes dopant clustering in grains as well as in grain boundaries. In addition, growth of grains and energy barrier height are coupled with the dopant diffusion coefficients and the process temperature based on thermodynamic concepts. The trapping-emission mechanism between grains and grain boundaries and crystallisation are the major effects during thermal annealing process. The adjustment of the simulated profiles with the experimental SIMS profiles for short treatment times ranging between 1 and 30 minutes at the temperature of 700degC allowed the validation of this model
Keywords :
annealing; boron; crystallisation; grain boundary diffusion; grain growth; grain size; heavily doped semiconductors; ion implantation; semiconductor doping; semiconductor thin films; 1 to 30 mins; 1D tow stream diffusion model; 700 C; SIMS profiles; boron; crystallisation; dopant clustering; dopant diffusion coefficients; energy barrier height; grain boundaries; grain growth; granular structure; heavily implanted polysilicon thin films; thermal annealing process; thermodynamic concepts; trapping-emission mechanism; Annealing; Boron; Circuits; Doping profiles; Grain boundaries; Ion implantation; Semiconductor process modeling; Silicon; Temperature distribution; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280018
Filename :
4060742
Link To Document :
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