DocumentCode
46186
Title
Buffer Traps in Fe-Doped AlGaN/GaN HEMTs: Investigation of the Physical Properties Based on Pulsed and Transient Measurements
Author
Meneghini, M. ; Rossetto, I. ; Bisi, D. ; Stocco, A. ; Chini, A. ; Pantellini, A. ; Lanzieri, C. ; Nanni, A. ; Meneghesso, G. ; Zanoni, E.
Author_Institution
Dept. of Inf. Eng., Univ. of Padua, Padua, Italy
Volume
61
Issue
12
fYear
2014
fDate
Dec. 2014
Firstpage
4070
Lastpage
4077
Abstract
This paper presents an extensive investigation of the properties of the trap with activation energy equal to 0.6 eV, which has been demonstrated to be responsible for current collapse (CC) in AlGaN/GaN HEMTs. The study was carried out on AlGaN/GaN HEMTs with increasing concentration of iron doping in the buffer. Based on pulsed characterization and drain current transient measurements, we demonstrate that for the samples under investigation: 1) increasing concentrations of Fe-doping in the buffer may induce a strong CC, which is related to the existence of a trap level located 0.63 eV below the conduction band energy and 2) this trap is physically located in the buffer layer, and is not related to the iron atoms but-more likely-to an intrinsic defect whose concentration depends on buffer doping. Moreover, we demonstrate that this level can be filled both under OFF-state conditions (by gate-leakage current) and under ON-state operation (when hot electrons can be injected to the buffer): for these reasons, it can significantly affect the switching properties of AlGaN/GaN HEMTs.
Keywords
III-V semiconductors; aluminium compounds; buffer circuits; conduction bands; electric current measurement; gallium compounds; high electron mobility transistors; hot carriers; leakage currents; semiconductor doping; wide band gap semiconductors; AlGaN-GaN HEMT; AlGaN-GaN:Fe; activation energy; buffer doping; buffer layer; buffer traps; conduction band energy; current collapse; drain current transient measurements; gate leakage current; hot electrons; intrinsic defect; iron doping; physical properties; pulsed characterization; pulsed measurements; switching properties; trap level; Aluminum gallium nitride; Doping; Electron traps; Gallium nitride; HEMTs; Logic gates; MODFETs; Transient analysis; Deep level transient spectroscopy (DLTS); defects; gallium nitride; high electron mobility transistor (HEMT); trap levels; trap levels.;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2364855
Filename
6960850
Link To Document