• DocumentCode
    46186
  • Title

    Buffer Traps in Fe-Doped AlGaN/GaN HEMTs: Investigation of the Physical Properties Based on Pulsed and Transient Measurements

  • Author

    Meneghini, M. ; Rossetto, I. ; Bisi, D. ; Stocco, A. ; Chini, A. ; Pantellini, A. ; Lanzieri, C. ; Nanni, A. ; Meneghesso, G. ; Zanoni, E.

  • Author_Institution
    Dept. of Inf. Eng., Univ. of Padua, Padua, Italy
  • Volume
    61
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    4070
  • Lastpage
    4077
  • Abstract
    This paper presents an extensive investigation of the properties of the trap with activation energy equal to 0.6 eV, which has been demonstrated to be responsible for current collapse (CC) in AlGaN/GaN HEMTs. The study was carried out on AlGaN/GaN HEMTs with increasing concentration of iron doping in the buffer. Based on pulsed characterization and drain current transient measurements, we demonstrate that for the samples under investigation: 1) increasing concentrations of Fe-doping in the buffer may induce a strong CC, which is related to the existence of a trap level located 0.63 eV below the conduction band energy and 2) this trap is physically located in the buffer layer, and is not related to the iron atoms but-more likely-to an intrinsic defect whose concentration depends on buffer doping. Moreover, we demonstrate that this level can be filled both under OFF-state conditions (by gate-leakage current) and under ON-state operation (when hot electrons can be injected to the buffer): for these reasons, it can significantly affect the switching properties of AlGaN/GaN HEMTs.
  • Keywords
    III-V semiconductors; aluminium compounds; buffer circuits; conduction bands; electric current measurement; gallium compounds; high electron mobility transistors; hot carriers; leakage currents; semiconductor doping; wide band gap semiconductors; AlGaN-GaN HEMT; AlGaN-GaN:Fe; activation energy; buffer doping; buffer layer; buffer traps; conduction band energy; current collapse; drain current transient measurements; gate leakage current; hot electrons; intrinsic defect; iron doping; physical properties; pulsed characterization; pulsed measurements; switching properties; trap level; Aluminum gallium nitride; Doping; Electron traps; Gallium nitride; HEMTs; Logic gates; MODFETs; Transient analysis; Deep level transient spectroscopy (DLTS); defects; gallium nitride; high electron mobility transistor (HEMT); trap levels; trap levels.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2364855
  • Filename
    6960850