• DocumentCode
    46344
  • Title

    Effects of Pad Array Dimensions and Misalignment Offsets on Optimal Fraction of Conductive Particles in Anisotropic Conductive Film Packages

  • Author

    Chao-Ming Lin

  • Author_Institution
    Dept. of Mech. & Energy Eng., Nat. Chiayi Univ., Chiayi, Taiwan
  • Volume
    13
  • Issue
    1
  • fYear
    2013
  • fDate
    Mar-13
  • Firstpage
    301
  • Lastpage
    309
  • Abstract
    The failure probability of anisotropic conductive film (ACF) packages is critically dependent on the volume fraction of conductive particles within the adhesive resin. In this study, the V-shaped curve method is used to determine the optimal volume fraction of conductive particles as a function of the bonding geometric parameters, the pad array dimension, and the misalignment offset between the upper and lower pads. In evaluating the corresponding failure probability of the ACF package, the probability of an opening failure is determined in accordance with a Poisson function model, while the probability of a bridging failure is derived using a box model. In computing the opening and bridging probabilities, the two models are modified to take account of the effects of package misalignments on the effective conductive area between opposing pads and the bridging path length between neighboring pairs of opposing pads, respectively. The opening and bridging probabilities are then combined using probability theory to establish the overall failure probability of the ACF package. In general, the results show that, for given bonding geometric parameters and misalignment offset, the optimal volume fraction of conductive particles remains approximately constant as the pad array dimension is increased. However, for given bonding geometric parameters and pad array dimension, the optimal volume fraction of conductive particles increases with an increasing misalignment error. Overall, the results show that, for any given values of the bonding geometric parameters, pad array dimension, and misalignment offset, the failure probability of the ACF package can be minimized by setting the volume fraction of conductive particles equal to the value corresponding to the tip of the V-shaped curve.
  • Keywords
    conducting polymers; conductive adhesives; electronics packaging; failure analysis; integrated circuit bonding; probability; resins; stochastic processes; ACF package; Poisson function model; V-shaped curve method; adhesive resin; anisotropic conductive film package; bonding geometric parameter; box model; bridging failure probability; bridging path length; conductive area; conductive particle; misalignment error; misalignment offset; opening failure probability; optimal volume fraction; package misalignment; pad array dimension; probability theory; Anisotropic conductive films; Arrays; Assembly; Bonding; Computational modeling; Conductivity; Anisotropic conductive film (ACF); failure probability; misalignment offset; pad array dimension; volume fraction;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2013.2245331
  • Filename
    6451225