Effect of Ni Surface Finish on Half Etched Cu on Solder Joint Reliability

Thermal cycling (TC) and drop test results of electronic package are presented in this paper, which have been known as the main reliability test items in electronics. Especially, as the movement of personal computer to handhelds accelerates, this paper focused on concurrent requirements for TC and drop reliability. The research was carried out by the modification of current solder pad finish and the comparative test results were represented. Considered that OSP on half etched Cu was normally used in mobile package, Ni/Au finish on half etched Cu was applied in this work. SnAgCu solder ball was used, and Ni/Sn on half etched Cu was also evaluated as Sn plating is used in some applications. Test results showed that Ni/Au finish on half etched Cu can be one of solutions to satisfy TC and drop reliability simultaneously.