DocumentCode
464685
Title
Incorporating Response Spectra and Modal Superposition in Analyzing Transient Responses of Structural Systems Subjected to Half-Sine Impact Acceleration Pulses
Author
Tsai, Tsung Yueh ; Yeh, Chang Lin ; Lai, Yi Shao ; Chen, Rong Sheng
Author_Institution
Adv. Semicond. Eng. Inc., Kaohsiung
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
543
Lastpage
547
Abstract
We derive in this paper close-form solutions for transient structural responses of a damped single degree of freedom structural system subjected to an impact acceleration pulse of a half-sine waveform. Applications of the response spectra to a JEDEC standard drop test board subjected to different JEDEC drop test conditions are demonstrated. An insight is also provided to analyzing transient structural responses of a multiple degrees of freedom structural system led by an identical type of impact acceleration pulses through modal superposition.
Keywords
acceleration; circuit reliability; electron device testing; impact (mechanical); printed circuit testing; transient response; JEDEC standard drop test board; half-sine impact acceleration pulses; modal superposition; printed circuit testing; response spectra; transient responses; Acceleration; Closed-form solution; Damping; Electron devices; Frequency measurement; Life estimation; Testing; Transient analysis; Vehicles; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373849
Filename
4249935
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