• DocumentCode
    464685
  • Title

    Incorporating Response Spectra and Modal Superposition in Analyzing Transient Responses of Structural Systems Subjected to Half-Sine Impact Acceleration Pulses

  • Author

    Tsai, Tsung Yueh ; Yeh, Chang Lin ; Lai, Yi Shao ; Chen, Rong Sheng

  • Author_Institution
    Adv. Semicond. Eng. Inc., Kaohsiung
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    543
  • Lastpage
    547
  • Abstract
    We derive in this paper close-form solutions for transient structural responses of a damped single degree of freedom structural system subjected to an impact acceleration pulse of a half-sine waveform. Applications of the response spectra to a JEDEC standard drop test board subjected to different JEDEC drop test conditions are demonstrated. An insight is also provided to analyzing transient structural responses of a multiple degrees of freedom structural system led by an identical type of impact acceleration pulses through modal superposition.
  • Keywords
    acceleration; circuit reliability; electron device testing; impact (mechanical); printed circuit testing; transient response; JEDEC standard drop test board; half-sine impact acceleration pulses; modal superposition; printed circuit testing; response spectra; transient responses; Acceleration; Closed-form solution; Damping; Electron devices; Frequency measurement; Life estimation; Testing; Transient analysis; Vehicles; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373849
  • Filename
    4249935