Title :
The Size Effect on the Creep Properties of SnAgCu-Solder Alloys
Author :
Wiese, S. ; Roellig, M. ; Mueller, M. ; Bennemann, S. ; Petzold, M. ; Wolter, K.-J.
Author_Institution :
Tech. Univ. Dresden, Dresden
fDate :
May 29 2007-June 1 2007
Abstract :
The paper describes the strategies of characterizing the creep behaviour of SnAg-and SnAgCu-solders through experiments on bulk specimens and on very tiny solder joints. The characteristic behaviour of these different volumes will be explained and rationalized by metallurgical considerations about the specifics of solidification in very small volumes.
Keywords :
copper alloys; creep; silver alloys; solidification; tin alloys; SnAgCu; SnAgCu-solder alloys; creep; solidification; Conducting materials; Cooling; Creep; Electronic packaging thermal management; Electronics packaging; Failure analysis; Manufacturing processes; Reliability theory; Soldering; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373850
