DocumentCode
464686
Title
The Size Effect on the Creep Properties of SnAgCu-Solder Alloys
Author
Wiese, S. ; Roellig, M. ; Mueller, M. ; Bennemann, S. ; Petzold, M. ; Wolter, K.-J.
Author_Institution
Tech. Univ. Dresden, Dresden
fYear
2007
fDate
May 29 2007-June 1 2007
Firstpage
548
Lastpage
557
Abstract
The paper describes the strategies of characterizing the creep behaviour of SnAg-and SnAgCu-solders through experiments on bulk specimens and on very tiny solder joints. The characteristic behaviour of these different volumes will be explained and rationalized by metallurgical considerations about the specifics of solidification in very small volumes.
Keywords
copper alloys; creep; silver alloys; solidification; tin alloys; SnAgCu; SnAgCu-solder alloys; creep; solidification; Conducting materials; Cooling; Creep; Electronic packaging thermal management; Electronics packaging; Failure analysis; Manufacturing processes; Reliability theory; Soldering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location
Reno, NV
ISSN
0569-5503
Print_ISBN
1-4244-0985-3
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2007.373850
Filename
4249936
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