DocumentCode
465064
Title
Comparison of Dual-Vt Configurations of SRAM Cell Considering Process-Induced Vt Variations
Author
Lee, Jungseob ; Davoodi, Azadeh
Author_Institution
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI
fYear
2007
fDate
27-30 May 2007
Firstpage
3018
Lastpage
3021
Abstract
This paper is a case study of dual-14 configurations of an SRAM cell considering process-induced Vt variations. Dual threshold voltage assignment is an effective technique to reduce leakage power without any area overhead, however as we will show the quality of a dual-threshold assignment highly varies due to process parameter variations in deca-nanometer designs of today. We analyze and compare the effects of process-induced Vt variations in 11 dominant dual-14 cell configurations. Under process variations each configuration is evaluated based on the probability density functions (pdfs) of its read delay, leakage current and read stability, accurately obtained using Monte Carlo simulations for 90nm generic process design kit of Cadence. Comparison of different cell configurations is based on evaluating these pdfs at points corresponding to a desired yield. We show that the choice of the best dual-Vt configuration varies depending on a given yield, and show tradeoff plots between read delay, leakage and read margin of different configurations under variations.
Keywords
Monte Carlo methods; SRAM chips; leakage currents; logic design; low-power electronics; probability; 90 nm; Monte Carlo simulations; SRAM cell; deca-nanometer designs; dual threshold voltage assignment; dual-Vt configurations; leakage current; leakage power reduction; probability density functions; process parameter variations; process-induced variations; read delay; read stability; Delay; Fluctuations; Leakage current; Power dissipation; Probability density function; Process design; Random access memory; Robustness; Stability analysis; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2007. ISCAS 2007. IEEE International Symposium on
Conference_Location
New Orleans, LA
Print_ISBN
1-4244-0920-9
Electronic_ISBN
1-4244-0921-7
Type
conf
DOI
10.1109/ISCAS.2007.377982
Filename
4253314
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