The Effect of Structural Parameters on Electrical Resitance of Microcontact Connections in Integrated Circuits

Author

Smerklo, Lubomyr ; Dyachok, Dmytro ; Hladun, Mykhaylo

Author_Institution

Lviv Radio Eng. Res. Inst., Lviv

fYear

2006

fDate

Feb. 28 2006-March 4 2006

Firstpage

619

Lastpage

619

Abstract

The mathematical equations for analysis of dependence of electric resistance of microcontact connection (MCC) on its dimension and intermediate resistance are considered. The computation software is designed. It is established that in proposed model the width and thickness of film conductor layer do not influence on MCC resistance and change of wire diameter impacts greatly on MCC resistance. For small MCC dimension its resistance is determined by intermediate contact resistance.

Keywords

contact resistance; integrated circuit interconnections; integrated circuits; computation software; contact resistance; electric resistance; electrical resitance; integrated circuits; mathematical equations; microcontact connections; structural parameters; Conductive films; Conductivity; Contact resistance; Electric resistance; Equations; Mathematical model; Software design; Structural engineering; Welding; Wire; contact resistance; microcontact connections;

fLanguage

English

Publisher

ieee

Conference_Titel

Modern Problems of Radio Engineering, Telecommunications, and Computer Science, 2006. TCSET 2006. International Conference

Conference_Location

Lviv-Slavsko

Print_ISBN

966-553-507-2

Type

conf

DOI

10.1109/TCSET.2006.4404657

Filename

4404657