A Fully-Integrated Flexible Photonic Platform for Chip-to-Chip Optical Interconnects

Author

Lan Li ; Yi Zou ; Hongtao Lin ; Juejun Hu ; Xiaochen Sun ; Ning-Ning Feng ; Danto, Sylvain ; Richardson, Kathleen ; Tian Gu ; Haney, Mike

Author_Institution

Dept. of Mater. Sci. & Eng., Univ. of Delaware, Newark, DE, USA

Volume

31

Issue

24

fYear

2013

fDate

Dec.15, 2013

Firstpage

4080

Lastpage

4086

Abstract

We analyze a chip-to-chip optical interconnect platform based on our recently developed flexible substrate integration technology. We show that the architecture achieves high bandwidth density (100 Tbs/cm²), and does not require optical alignment during packaging. These advantages make the flexible photonics platform a promising solution for chip-to-chip optical interconnects. We further report initial experimental characterizations of the flexible photonics platform fabricated using thermal nanoimprint patterning of glass waveguides and III-V die bonding.

Keywords

integrated optics; optical fabrication; optical interconnections; III-V die bonding; chip-to-chip optical interconnect platform; chip-to-chip optical interconnects; flexible photonics platform; flexible substrate integration technology; fully-integrated flexible photonic platform; glass waveguides; optical alignment; packaging; thermal nanoimprint patterning; Glass; Optical interconnections; Optical surface waves; Optical waveguides; Photonics; Substrates; Data communications; energy per bit; optical interconnects; optical waveguides;

fLanguage

English

Journal_Title

Lightwave Technology, Journal of

Publisher

ieee

ISSN

0733-8724

Type

jour

DOI

10.1109/JLT.2013.2285382

Filename

6627955