• DocumentCode
    469365
  • Title

    Mechanical Behaviour of Grains in SnAgCu Solder Joints

  • Author

    Gong, Jicheng ; Liu, Changging ; Conway, Paul P. ; Silberschmidt, Vadim V.

  • Author_Institution
    Loughborough Univ., Loughborough
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    21
  • Abstract
    A collection of slides from the authors conference presentation is given.
  • Keywords
    copper alloys; crystal microstructure; flip-chip devices; mechanical properties; shearing; silver alloys; solders; SnAgCu; flip chip electronics; grains; mechanical behaviour; microstructure; shearing test; single crystal; solder joints; Manufacturing; Soldering; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430595
  • Filename
    4430595
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=469365