• DocumentCode
    471671
  • Title

    Long-Term Characterization of Electrode Materials for Surface Electrodes in Biopotential Recording

  • Author

    Hoffmann, Klaus-Peter ; Ruff, Roman ; Poppendieck, Wigand

  • Author_Institution
    Dept. of Med. Technol. & Neural Prosthetics, Fraunhofer IBMT, St. Ingbert
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    2239
  • Lastpage
    2242
  • Abstract
    The long-term electrical behavior of 16 different electrode materials was investigated by using continuous impedance spectroscopy over a period of 10 days. The materials included bare and electrolytically treated metals, metals coated with intrinsically conductive polymers, and polymers with conductive particles. Electrolytic treatment of metal electrodes yielded a significant impedance reduction. The lowest impedance values could be reached with the polymer-coated metal electrodes. The impedance behavior is an important aspect when choosing an electrode material, and has to be considered in signal processing. The choice of a material depends on the application of the electrode. Moreover, for long-term applications, the electrochemical stability of a material has to be considered
  • Keywords
    bioelectric potentials; biomedical electrodes; conducting polymers; electrochemical analysis; electrolysis; polymer films; biopotential recording; conductive particles; continuous impedance spectroscopy; electrochemical stability; electrode materials; electrolytic treatment; impedance behavior; impedance reduction; intrinsically conductive polymers; long-term electrical characterization; metal coating; polymer-coated metal electrodes; surface electrodes; Biological materials; Biomedical signal processing; Conducting materials; Electrochemical impedance spectroscopy; Electrodes; Inorganic materials; Polymer films; Stability; Surface impedance; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260443
  • Filename
    4462236