DocumentCode
472867
Title
Reactive Ion Etching of Poly-Si Employing Cl2 and Cl2/H2 Systems
Author
Watanabe, T. ; Shibagaki, M. ; Horiike, Y.
Author_Institution
Toshiba Corporation, Kawasaki, Japan
fYear
1982
fDate
1-3 Sept. 1982
Firstpage
104
Lastpage
105
Keywords
Anisotropic magnetoresistance; Control systems; Effluents; Etching; Fluid flow; Gases; Hydrogen; Pressure control; Voltage; Weight control;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1982. Digest of Technical Papers. Symposium on
Conference_Location
Oiso, Japan
Type
conf
Filename
4480598
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