• DocumentCode
    472896
  • Title

    Microcapiliary Thermal Interface Technology for VLSI Packaging

  • Author

    Tuckerman, David B. ; Pease, R.Fabian

  • Author_Institution
    Stanford Electronics Laboratories Stanford University Stanford, CA 94305
  • fYear
    1983
  • fDate
    13-15 Sept. 1983
  • Firstpage
    60
  • Lastpage
    61
  • Keywords
    Electronic packaging thermal management; Heat sinks; Microscopy; Shape; Silicon; Surface resistance; Surface tension; Thermal conductivity; Thermal resistance; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1983. Digest of Technical Papers. Symposium on
  • Conference_Location
    Maui, HI, USA
  • Print_ISBN
    4-930813-05-0
  • Type

    conf

  • Filename
    4480636
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=472896