DocumentCode
472909
Title
Interfacial Oxidation of Ta2O5-Si Systems for High-Density D-RAM
Author
Kato, T. ; Ito, T. ; Taguchi, M. ; Nakamura, T. ; Ishikawa, H.
Author_Institution
Fujitsu Laboratories Ltd., Atsugi 1677 Ono, Atsugi 243-01, Japan
fYear
1983
fDate
13-15 Sept. 1983
Firstpage
86
Lastpage
87
Abstract
The authors developed a new method of oxidation in which oxidizing species are applied through Ta2O5 films. Effective breakdown fields of the developed films are sharply distributed around 17 MV/cm. The developed films with an upper electrode of MoSix (x¿2) will be useful to the production of ultra-high density D-RAM.
Keywords
Annealing; Capacitors; Dielectric substrates; Dielectric thin films; Diodes; Electrodes; Leakage current; Material storage; Oxidation; Semiconductor films;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1983. Digest of Technical Papers. Symposium on
Conference_Location
Maui, HI, USA
Print_ISBN
4-930813-05-0
Type
conf
Filename
4480649
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