• DocumentCode
    474248
  • Title

    Terahertz integrated device using a transferred thin-film GaAs layer on silicon substrates

  • Author

    Ouchi, T. ; Kasai, S. ; Kurosaka, R. ; Itsuji, T. ; Yoneyama, H. ; Yamashita, M. ; Ito, H.

  • Author_Institution
    Terahertz Biol. Sensing Res. Lab., RIKEN, Wako
  • fYear
    2007
  • fDate
    2-9 Sept. 2007
  • Firstpage
    957
  • Lastpage
    959
  • Abstract
    We developed thin-film GaAs transfer technique for integrated terahertz (THz) generating and detecting devices. Photoconductive switch elements on Si substrate are important for avoiding GaAs absorption to measure in wide frequency range. THz emission amplitude and Fourier transform spectrum band range become larger by replacing GaAs substrate with Si substrate. Transmission line device with the transferred GaAs layer on Si substrate is also fabricated for high sensitive sensors. It was found that peak shift of THz pulse was proportional to apply volume of samples and the sensitivity strongly depended upon the width of the transmission line.
  • Keywords
    III-V semiconductors; gallium arsenide; photoconducting switches; submillimetre wave integrated circuits; thin film devices; Fourier transform spectrum band range; GaAs; THz emission amplitude; THz pulse; detecting devices; generating devices; photoconductive switch elements; silicon substrates; terahertz integrated device; thin-film GaAs layer; transmission line device; Absorption; Frequency measurement; Gallium arsenide; Photoconductivity; Semiconductor thin films; Silicon; Substrates; Switches; Thin film devices; Transmission line measurements; Millimeter wave devices; Photoconducting devices; Thin film devices; Time domain measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared and Millimeter Waves, 2007 and the 2007 15th International Conference on Terahertz Electronics. IRMMW-THz. Joint 32nd International Conference on
  • Conference_Location
    Cardiff
  • Print_ISBN
    978-1-4244-1438-3
  • Type

    conf

  • DOI
    10.1109/ICIMW.2007.4516809
  • Filename
    4516809