Advanced Laser Microprocessing for Substrates Microprocessing of Microsystems and Optoelectronics Devices Applications

Lasers are an important tool in the fabrication of microsystems like MOEMS and photonic components and in particular their use in scribing for separating LED dies on sapphire substrates. This paper describes scribing and cutting of sapphire and GaN using UV lasers (355 nm and 266 nm harmonics of Nd:YVO₄ and 255 nm harmonic of CVL). Scribing of sapphire at speeds of 30 mm/s have been achieved and cutting of sapphire of up to 700 microns thickness has been demonstrated.