• DocumentCode
    474432
  • Title

    Compositional verification of retiming and sequential optimizations

  • Author

    Moon, In-Ho

  • Author_Institution
    Synopsys Inc., Hillsboro, OR
  • fYear
    2008
  • fDate
    8-13 June 2008
  • Firstpage
    131
  • Lastpage
    136
  • Abstract
    Once a design is both retimed and sequentially optimized, sequential equivalence verification becomes very hard since retiming breaks the equivalence of the retimed sub-blocks although the design equivalence is preserved. This paper presents a novel compositional algorithm to verify sequential equivalence of large designs that are not only retimed but also optimized sequentially and combinationally. With a new notion of conditional equivalence in the presence of retiming, the proposed compositional algorithm performs hierarchical verification by checking whether each sub-block is conditionally equivalent, then checking whether the conditions are justified on their parent block by temporal equivalence. This is the first compositional algorithm handling both retiming and sequential optimizations hierarchically. The proposed approach is completely automatic and orthogonal to any existing sequential equivalence checker. The experimental results show that the proposed algorithm can handle large industrial designs that cannot be verified by the existing methods on sequential equivalence checking.
  • Keywords
    circuit optimisation; formal verification; logic design; sequential circuits; compositional verification; industrial designs; retiming optimization; sequential equivalence checker; sequential equivalence verification; sequential optimization; temporal equivalence; Algorithm design and analysis; Design methodology; Design optimization; Logic design; Moon; Permission; Sequential analysis; Compositional verification; Conditional equivalence; Retime offset; Retiming; Sequential equivalence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-60558-115-6
  • Type

    conf

  • Filename
    4555796