Keeping hot chips cool: Are IC thermal problems hot air?

Author

Puri, Ruchir ; Varma, Devadas ; Edwards, Darvin ; Franzon, Paul ; Kosonocky, Stephen ; Weger, Alan J. ; Yang, Andrew

Author_Institution

IBM Corp., Yorktown Heights, NY

fYear

2008

fDate

8-13 June 2008

Firstpage

634

Lastpage

635

Abstract

Thermal issues are becoming more important but is the hype getting the better of the facts? Does this deserve more attention than for some niche designs and technologies such as 3D ICs.? Does the broader design community need to worry about it at 32 nm and beyond or it will only impact a small segment of designs? In short, does the severity of power issues coupled with packaging complexity translate into a thermal crisis in future? This is an educational panel with a little bit of controversy that will address the thermal issue in IC design. When will this issue be emerging as a crucial concern if at all? What are the solutions to resolve this potential crisis?

Keywords

VLSI; cooling; integrated circuit design; integrated circuit packaging; thermal management (packaging); 3D IC technology; IC design; IC thermal problems; VLSI design; packaging complexity; power dissipation; size 32 nm; thermal crisis; thermal management; Algorithm design and analysis; Electronic packaging thermal management; Energy management; Integrated circuit packaging; Power dissipation; Power system management; Process design; Temperature; Thermal engineering; Thermal management; Power dissipation; Thermal management; VLSI design;

fLanguage

English

Publisher

ieee

Conference_Titel

Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE

Conference_Location

Anaheim, CA

ISSN

0738-100X

Print_ISBN

978-1-60558-115-6

Type

conf

Filename

4555895