Thermal analysis of feasibility of air cooling system in S Band Transmit Module

The paper describes thermal investigation of an S band transmit module with air cooling system. Temperatures of high power transistor junctions and temperature distribution in transmit module were computed by a professional computer tool. Due to intention of applying transmit module in an antenna cabin, the size of air-cooling system and air flow rate of the used fans were especially taken into account. The influence of cooling system parameters on temperature of transistors is presented. Results of measurements of the already developed and manufactured S band transmit module with liquid cooling system were compared with the results of its thermal simulation to prove the correctness of the thermal analysis.