Title :
Robust Pop-Up Shape Encapsulation Using Dual-Sealing
Author :
Jae-Wung Lee ; Sharma, Jaibir ; Merugu, Srinivas ; Singh, Navab
Author_Institution :
Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
Abstract :
This letter presents pop-up-shaped (having a spherical top shape) thin film encapsulation (TFE) using two-step sealing method. The first sealing step seals the etch holes in the cap layer, whereas the second step provides the shape. A pop-up shape with 2.4-μm upward deformation is demonstrated using a negative pressure difference between the two sealing layers-0.5-μm SiN at 1100 mTorr followed by 3-μm SiO2 at 390 mTorr on an aluminum nitride cap encapsulating 800-μm × 800-μm size cavities. Besides a deeper cavity, the pop-up shape has smaller downward deformation of the cap layer due to its sturdy design. The increase in the robustness of TFE with pop-up radius is verified through finite element method simulations and theoretical calculation.
Keywords :
aluminium compounds; encapsulation; finite element analysis; micromechanical devices; seals (stoppers); silicon compounds; thin films; MEMS; SiN; SiO2; cap layer; downward deformation; etch holes; finite element method; pressure 1100 mtorr; pressure 390 mtorr; robust pop-up shape encapsulation; sealing layers; size 0.5 mum; size 2.4 mum; size 3 mum; size 800 mum; thin film encapsulation; two-step sealing method; Cavity resonators; Encapsulation; III-V semiconductor materials; Micromechanical devices; Robustness; Shape; Silicon compounds; Thin film encapsulation; microelectromechanical system (MEMS); packaging; release time; robustness packaging; robustness packaging.;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2014.2326851
