• DocumentCode
    481008
  • Title

    Brining together high-tech laboratories and e-Learning infrastructures

  • Author

    Ferber, Ferdinand ; Giessmann, M. ; Hampel, Thorsten ; Schulte, Jonas

  • Author_Institution
    Dept. of Eng. Mech., Univ. of Paderborn, Paderborn
  • Volume
    2
  • fYear
    2008
  • fDate
    10-12 Sept. 2008
  • Firstpage
    361
  • Lastpage
    364
  • Abstract
    Most of todaypsilas collaborative systems are designed as a single, monolithic application. Although there are rare approaches to implement cross-functional architectures, these approaches lack in terms of taking high-tech laboratories into consideration. We understand high-tech laboratories as a kind of knowledge source and have identified an increasing demand for integrating these labs into university-wide e-learning infrastructures. A major challenge are proprietary and manufacturer-specific interfaces of laboratoriespsila equipment. Therefore this article presents a service-oriented architecture (SOA) for a thermal-shock laboratory to close the gap between knowledge creation and knowledge usage. In this respect digital libraries figure a key role as a place for archiving, structuring documents (e.g. test results), and making these available in an e-learning infrastructure.
  • Keywords
    computer aided instruction; educational institutions; laboratories; software architecture; collaborative systems; cross-functional architectures; high-tech laboratories; knowledge source; service-oriented architecture; thermal-shock laboratory; university-wide e-learning infrastructures; Design engineering; Electronic learning; Information retrieval; International collaboration; Laboratories; Mechanical engineering; Service oriented architecture; Software libraries; Testing; Thermal stresses; SOA; digital library; e-learning; infrastructure; mechanical engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ELMAR, 2008. 50th International Symposium
  • Conference_Location
    Zadar
  • ISSN
    1334-2630
  • Print_ISBN
    978-1-4244-3364-3
  • Type

    conf

  • Filename
    4747518