• DocumentCode
    48272
  • Title

    Nanocrystalline Diamond-Gated AlGaN/GaN HEMT

  • Author

    Anderson, Travis J. ; Koehler, Andrew D. ; Hobart, Karl D. ; Tadjer, Marko J. ; Feygelson, Tatyana I. ; Hite, Jennifer K. ; Pate, Bradford B. ; Kub, Francis J. ; Eddy, Charles R.

  • Author_Institution
    Naval Res. Lab., Washington, DC, USA
  • Volume
    34
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    1382
  • Lastpage
    1384
  • Abstract
    Boron-doped p+ nanocrystalline diamond (NCD) films are implemented as heat spreading gate contacts to AlGaN/GaN high-electron-mobility transistors. This device demonstrates a reduced ON-resistance, reduced gate leakage, and significantly increased ON-state current density compared with the reference Ni/Au-gated devices from the same wafer. The NCD gate electrode is thermally stable, chemically stable, optically transparent, and places a heat spreading film in direct contact with the gate edge, which is the hottest part of the device.
  • Keywords
    III-V semiconductors; aluminium compounds; boron; current density; diamond; gallium compounds; high electron mobility transistors; leakage currents; nanostructured materials; thermal stability; transparency; wide band gap semiconductors; AlGaN-GaN-C:B; ON-resistance; ON-state current density; boron-doped p± nanocrystalline diamond films; chemical stability; gate leakage; heat spreading gate contacts; high-electron-mobility transistors; nanocrystalline diamond-gated AlGaN/GaN HEMT; optical transparency; thermal stability; Aluminum gallium nitride; Diamonds; Gallium nitride; HEMTs; Heating; Logic gates; Thermal stability; Gallium nitride (GaN); high-electron-mobility transistor (HEMT); nanocrystalline diamond;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2282968
  • Filename
    6630055