• DocumentCode
    483343
  • Title

    On the relevance of IC ESD performance to product quality

  • Author

    Smedes, T. ; Christoforou, Y.

  • Author_Institution
    NXP Semicond., Nijmegen, Netherlands
  • fYear
    2008
  • fDate
    7-11 Sept. 2008
  • Firstpage
    14
  • Lastpage
    20
  • Abstract
    Correlations between ESD stress results and return rates are investigated for various product types. It appears that CDM data relates better to product quality than HBM and/or MM data. The paper clearly demonstrates the need for application specific stress standards to cover threats coming from external connections.
  • Keywords
    electrostatic discharge; integrated circuit testing; ESD stress; HBM; IC ESD performance; product quality; Automotive engineering; CMOS process; CMOS technology; Earth Observing System; Electrostatic discharge; Industrial relations; Pins; Pulp and paper industry; Qualifications; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
  • Conference_Location
    Tucson, AZ
  • Print_ISBN
    978-1-58537-146-4
  • Electronic_ISBN
    978-1-58537-147-1
  • Type

    conf

  • Filename
    4772110
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=483343