Title :
Statistical pin pair combinations — a new proposal for device level HBM tests
Author :
Brodbeck, Tilo ; Gaertner, Reinhold ; Stadler, Wolfgang ; Duvvury, Charvaka
Author_Institution :
Infineon Technol., Munich, Germany
Abstract :
This paper proposes an alternate HBM test strategy to reflect today¿s IC designs and package. The detailed proposal outlines a new procedure where all IC pins are treated equally, and the pin pair combinations are selected statistically. Some initial experimental data is presented to illustrate the validity and advantages of this procedure.
Keywords :
integrated circuit design; integrated circuit packaging; integrated circuit testing; HBM test strategy; IC designs; IC package; pin pair combinations; Assembly; Electrostatic discharge; Failure analysis; Instruments; Integrated circuit packaging; Integrated circuit testing; Pins; Proposals; Stress; System testing;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2008. EOS/ESD 2008. 30th
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-58537-146-4
Electronic_ISBN :
978-1-58537-147-1
