• DocumentCode
    48354
  • Title

    Frequency Trimming of Aluminum Nitride Microresonators Using Rapid Thermal Annealing

  • Author

    Henry, M.D. ; Nguyen, John ; Young, Travis Ryan ; Bauer, Thomas ; Olsson, Roy H.

  • Author_Institution
    MESA Fabrication Facility, Sandia Nat. Labs., Albuquerque, NM, USA
  • Volume
    23
  • Issue
    3
  • fYear
    2014
  • fDate
    Jun-14
  • Firstpage
    620
  • Lastpage
    627
  • Abstract
    To transition aluminum nitride (AlN) microresonator filters into a manufacturable technology, accurate control of the resonator frequency across a wafer is required. This paper describes a postfabrication rapid thermal anneal approach to trim resonator frequency over 27000 ppm with an accuracy of 500 ppm. Measurements made on 22.4 MHz resonators indicate that the effect of annealing on the resonators saturates in 5 min and upshift the resonator frequency super linearly with temperature. We replicate the frequency trimming effect on hermetically sealed wafer level packaged devices to reduce the across-wafer frequency distribution from 22000 to 4000 ppm. We confirm that this postannealing technique is permanent by temperature cycling the resonators from 50°C to 125°C. This technique provides a method to trim AlN microresonator frequency overcoming effects such as thin film variations, which are inherent to microsystems fabrication.
  • Keywords
    III-V semiconductors; aluminium compounds; hermetic seals; microcavities; micromechanical resonators; rapid thermal annealing; semiconductor thin films; wafer level packaging; AlN; across-wafer frequency distribution; aluminum nitride microresonators; frequency 22.4 MHz; frequency trimming; hermetically sealed wafer level packaged devices; manufacturable technology; microresonator filters; microsystems fabrication; rapid thermal annealing; resonator frequency; temperature cycling; thin film variations; time 5 min; transition aluminum nitride; Annealing; Fabrication; Frequency measurement; III-V semiconductor materials; Metals; Resonant frequency; Temperature measurement; Microresonators; acoustic resonators; microelectromechanical devices; rapid thermal annealing; wafer scale integration; wafer scale integration.;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2013.2283801
  • Filename
    6630061