DocumentCode :
483748
Title :
Unipolar SiC devices - latest achievements on the way to a new generation of high voltage power semiconductors
Author :
Friedrichs, Peter
Author_Institution :
SiCED Electron. Dev. GmbH & Co. KG, Erlangen
Volume :
1
fYear :
2006
fDate :
14-16 Aug. 2006
Firstpage :
1
Lastpage :
5
Abstract :
Silicon carbide power devices are supposed to revolutionize certain parts of the power semiconductor business. After the successful product release of Schottky barrier diodes in 2001 and the development of a new generation of surge current stable diodes in 2005, the next logical step in the device chain should be a SiC switching device. Addressable are high voltage applications in energy systems as well as the huge market for low voltage power switches, where even in the blocking voltage range below 100 V SiC is assumed to be one potential candidate for meeting the increasing demands on power density. The paper will give an overview about latest developments of SiC power switches and diodes. In addition, some potential applications serving as drivers for the SiC power device development will be sketched. Finally, an outlook to near and long term perspectives for SiC power devices is given.
Keywords :
Schottky diodes; power semiconductor diodes; power semiconductor switches; silicon compounds; Schottky barrier diodes; SiC; blocking voltage; energy systems; high voltage applications; high voltage power semiconductors; low voltage power switches; power density; power switches; silicon carbide power devices; surge current stable diodes; switching device; unipolar silicon carbide devices; Consumer electronics; Power electronics; Power generation; Power semiconductor switches; Schottky barriers; Schottky diodes; Semiconductor diodes; Silicon carbide; Voltage; Wide band gap semiconductors; diodes; power density; silicon carbide; switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Motion Control Conference, 2006. IPEMC 2006. CES/IEEE 5th International
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0448-7
Type :
conf
DOI :
10.1109/IPEMC.2006.4777962
Filename :
4777962
Link To Document :
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