DocumentCode
49013
Title
Observation and Elimination of Recoil Particles From Turbo Molecular Pumps
Author
Moriya, Tsuyoshi ; Sugawara, Eiichi ; Matsui, Hidefumi
Author_Institution
Technol. Dev. Center, Tokyo Electron Ltd., Tokyo, Japan
Volume
28
Issue
3
fYear
2015
fDate
Aug. 2015
Firstpage
253
Lastpage
259
Abstract
The existence of recoil particles from the turbo molecular pump has been verified. The recoil particles may be the root cause of yield degradation for the vacuum processes such as the plasma etching processes. To eliminate the recoil particles, they must be trapped inside the turbo molecular pump or inside the manifold chamber. After experimenting with various materials and designs, we have built a novel recoil particle trap and verified its effectiveness in a semiconductor production line.
Keywords
particle traps; pumps; semiconductor device manufacture; sputter etching; manifold chamber; plasma etching process; recoil particle trap; semiconductor production line; turbo molecular pump; vacuum process; yield degradation; Blades; Cotton; Etching; Manifolds; Plasmas; Valves; Plasma applications; Semiconductor device manufacture; Semiconductor device manufacturer; Vacuum technology; particle measurements; plasma applications; vacuum technology;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2015.2427912
Filename
7097729
Link To Document