DocumentCode
491898
Title
Thermally stable polymeric waveguide using UV-curable epoxy resins for optical printed-circuit board
Author
Kim, Do-Won ; Ahn, Seung Ho ; Cho, In-Kui ; Im, Dong-Min ; Muslim, Shirazy Md Shorab ; Park, Hyo-Hoon
Author_Institution
Photonic Comput. Syst. Lab., Inf. & Commun. Univ., Daejeon
Volume
02
fYear
2009
fDate
15-18 Feb. 2009
Firstpage
1430
Lastpage
1432
Abstract
Thermally stable and cost-effective polymeric optical waveguide has been fabricated using UV-curable epoxy resins. Reusable polydimethylsiloxane (PDMS) masters which were prepared using hot-embossing imprinting technique were used as main masters for the fabrication of optical waveguide. Thermal and optical properties of the fabricated optical waveguide were investigated. After the thermal stability test at 200degC for 1 hour, the physical state of the waveguide was not changed and optical propagation loss measured by the cut-back method increased from 0.16 dB/cm to 0.26 dB/cm. This waveguide is estimated to be used for the embedding in optical printed-circuit board (OPCB).
Keywords
embossing; integrated optoelectronics; optical fabrication; optical losses; optical polymers; optical waveguides; printed circuits; resins; thermal stability; thermo-optical effects; UV-curable epoxy resin; cut-back method; hot-embossing imprinting technique; optical printed-circuit board; optical propagation loss; optical waveguide fabrication; polydimethylsiloxane; temperature 200 C; thermally stable polymeric waveguide; time 1 hour; Epoxy resins; Optical device fabrication; Optical losses; Optical polymers; Optical propagation; Optical waveguides; Propagation losses; Testing; Thermal stability; Waveguide transitions; Polymeric optical waveguide; UV-curable epoxy resins; optical interconnection; optical printed circuit board; propagation loss; thermal stability test;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Communication Technology, 2009. ICACT 2009. 11th International Conference on
Conference_Location
Phoenix Park
ISSN
1738-9445
Print_ISBN
978-89-5519-138-7
Electronic_ISBN
1738-9445
Type
conf
Filename
4809684
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