• DocumentCode
    491898
  • Title

    Thermally stable polymeric waveguide using UV-curable epoxy resins for optical printed-circuit board

  • Author

    Kim, Do-Won ; Ahn, Seung Ho ; Cho, In-Kui ; Im, Dong-Min ; Muslim, Shirazy Md Shorab ; Park, Hyo-Hoon

  • Author_Institution
    Photonic Comput. Syst. Lab., Inf. & Commun. Univ., Daejeon
  • Volume
    02
  • fYear
    2009
  • fDate
    15-18 Feb. 2009
  • Firstpage
    1430
  • Lastpage
    1432
  • Abstract
    Thermally stable and cost-effective polymeric optical waveguide has been fabricated using UV-curable epoxy resins. Reusable polydimethylsiloxane (PDMS) masters which were prepared using hot-embossing imprinting technique were used as main masters for the fabrication of optical waveguide. Thermal and optical properties of the fabricated optical waveguide were investigated. After the thermal stability test at 200degC for 1 hour, the physical state of the waveguide was not changed and optical propagation loss measured by the cut-back method increased from 0.16 dB/cm to 0.26 dB/cm. This waveguide is estimated to be used for the embedding in optical printed-circuit board (OPCB).
  • Keywords
    embossing; integrated optoelectronics; optical fabrication; optical losses; optical polymers; optical waveguides; printed circuits; resins; thermal stability; thermo-optical effects; UV-curable epoxy resin; cut-back method; hot-embossing imprinting technique; optical printed-circuit board; optical propagation loss; optical waveguide fabrication; polydimethylsiloxane; temperature 200 C; thermally stable polymeric waveguide; time 1 hour; Epoxy resins; Optical device fabrication; Optical losses; Optical polymers; Optical propagation; Optical waveguides; Propagation losses; Testing; Thermal stability; Waveguide transitions; Polymeric optical waveguide; UV-curable epoxy resins; optical interconnection; optical printed circuit board; propagation loss; thermal stability test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Communication Technology, 2009. ICACT 2009. 11th International Conference on
  • Conference_Location
    Phoenix Park
  • ISSN
    1738-9445
  • Print_ISBN
    978-89-5519-138-7
  • Electronic_ISBN
    1738-9445
  • Type

    conf

  • Filename
    4809684