• DocumentCode
    49268
  • Title

    Complementary SOI MESFETs at the 45-nm CMOS Node

  • Author

    Lepkowski, William ; Wilk, Seth J. ; Thornton, Trevor J.

  • Author_Institution
    RF Micropower Inc., Fountain Hills, CO, USA
  • Volume
    36
  • Issue
    1
  • fYear
    2015
  • fDate
    Jan. 2015
  • Firstpage
    14
  • Lastpage
    16
  • Abstract
    Silicon-on-insulator (SOI) metal-semiconductor field-effect transistors (MESFETs) with complementary n- and p-type channels have been fabricated using a commercial 45-nm CMOS process. The current drive and transconductance of the n-MESFET is approximately three times larger than that of the p-MESFET due to the higher electron mobility. Both devices operate in depletion mode with the threshold voltage of the n-MESFET being approximately -0.4 V, while that of the p-MESFET is ~0.3 V. The MESFETs have multiple gigahertz cutoff frequencies and can withstand drain bias in excess of 4 V making them attractive for analog- and mixed-signal applications that require higher operating voltages than the baseline CMOS. The p-MESFET has higher leakage current due to the lower Schottky barrier height to the p-type channel.
  • Keywords
    CMOS integrated circuits; Schottky gate field effect transistors; electron mobility; leakage currents; silicon-on-insulator; CMOS node; Schottky barrier height; analog-signal application; complementary SOI MESFET; current drive; depletion mode; drain bias; gigahertz cutoff frequency; higher electron mobility; leakage current; metal-semiconductor field-effect transistor; mixed-signal application; n-MESFET transconductance; n-type channel; p-MESFET; p-type channel; silicon-on-insulator; size 45 nm; threshold voltage; CMOS integrated circuits; Leakage currents; Logic gates; MESFETs; Radio frequency; Silicides; Silicon-on-insulator; CMOS processing; MESFETs; Schottky junction; Silicon-on-insulator; partially-depleted; silicon-on-insulator;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2373148
  • Filename
    6963317