DocumentCode :
493308
Title :
Heat-based recovery mechanism to counteract stiction of RF-MEMS switches
Author :
Repchankova, A. ; Iannacci, J.
Author_Institution :
DISI Univ. di Trento, Trento
fYear :
2009
fDate :
1-3 April 2009
Firstpage :
176
Lastpage :
181
Abstract :
Stiction of MEMS (microelectromechanical system) switches for RF (radio frequency) applications is a critical issue as it may jeopardize temporarily or permanently the operability of such devices. In this work we present a novel mechanism to enable the self-recovery of RF-MEMS switches in case of stiction. It is based on the application of a restoring force on the stuck membrane, induced by the thermal stress due to self-heating of the switch itself. The heat is generated by a current driven through a high resistivity polysilicon serpentine housed underneath the anchoring points of the suspended switch. After a detailed theoretical analysis, we will report FEM-simulation results (finite element method) describing the behaviour of the structure discussed in this paper.
Keywords :
finite element analysis; membranes; microswitches; microwave switches; stiction; thermal stresses; FEM-simulation; RF-MEMS switches; heat-based recovery mechanism; high resistivity polysilicon serpentine; microelectromechanical system; radio frequency applications; stuck membrane; suspended switch; thermal stress; Biomembranes; Conductivity; Heat recovery; Microelectromechanical systems; Micromechanical devices; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Thermal force; Thermal stresses; RF-MEMS switch; self-recovery mechanism; stiction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3874-7
Type :
conf
Filename :
4919512
Link To Document :
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