DocumentCode
494377
Title
A Kind of New Intelligent Monitor and Control System Based on Sensors Technology
Author
Yu, Chen ; Zhao, Dongbo
Author_Institution
Zhengzhou Inst. of Aeronaut. Ind. Manage., Zhengzhou
Volume
1
fYear
2008
fDate
21-22 Dec. 2008
Firstpage
397
Lastpage
400
Abstract
In heat treatment and other industry detection region, we usually adopt artificial or conventional instrument to control heat treatment furnacepsilas temperature. But due to fluctuation amplitude of furnace temperature is larger, which usually lead to poor production quality appearance. Aiming to this problem, we design an intelligent heat treatment furnacepsilas temperature intelligent monitor and control system based on single chip microprocessor (SCM) AT89C52. Through cold segment concentration technology, and automatic control technology, etc, system can efficiently realize heat treatment furnacepsilas temperature distributed monitor, control and centralized management. Experiment shows that system can accurately control heat treatment furnacepsilas temperature in real time, and temperature monitor error reaches monitor requirement, as well as realizes sound-light alarming once furnacepsilas fact temperature is out of setting limit value.
Keywords
furnaces; heat treatment; intelligent control; microprocessor chips; process control; temperature control; temperature sensors; cold segment concentration; heat treatment furnace temperature control; industry detection region; intelligent monitor-control system; sensor technology; single chip microprocessor; Artificial intelligence; Automatic control; Control systems; Heat treatment; Intelligent control; Intelligent sensors; Monitoring; Sensor systems; Temperature control; Temperature sensors; SCM; heat treatment furnace temperature; intelligent monitor and control; sensor technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Education Technology and Training, 2008. and 2008 International Workshop on Geoscience and Remote Sensing. ETT and GRS 2008. International Workshop on
Conference_Location
Shanghai
Print_ISBN
978-0-7695-3563-0
Type
conf
DOI
10.1109/ETTandGRS.2008.78
Filename
5070180
Link To Document