• DocumentCode
    494975
  • Title

    Creep Model on Simulating In-mold Stress in Injection Molded Polymers

  • Author

    Wu, Hai-hong ; Sha, Jie ; Liu, Zi-ran

  • Author_Institution
    Coll. of Electromech. Eng., Henan Univ. of Technol., Zhengzhou, China
  • Volume
    3
  • fYear
    2009
  • fDate
    21-22 May 2009
  • Firstpage
    66
  • Lastpage
    69
  • Abstract
    In-mold stress may occur for injection molded parts during the cooling stage. It not only affects the shrinkage of the part, but also has great influence on its mechanical properties. In this paper, stress-strain response was studied under the action of temperature and packing pressure in the process of injection molding. Furthermore, a new model was set to simulate the level of in-mold stresses in injection molded parts, and its creep constitutive equation was obtained. Instead of dealing with viscoelastic parameters of the polymer with WLF equation, the viscous factor was calculated with inversion method and the formula of elastic module was directly derived from P-V-T equation. The in-mold stresses in injection molded plates were simulated with the model. The results revealed that the new approach is reliable and accurate.
  • Keywords
    creep; elastic moduli; injection moulding; polymers; shrinkage; stress-strain relations; viscoelasticity; P-V-T equation; WLF equation; creep modelling; elastic modulus; injection moulding; inmold stress; packing pressure; polymers; shrinkage; stress-strain response; viscoelastic parameters; Cooling; Creep; Elasticity; Equations; Injection molding; Mechanical factors; Polymers; Stress; Temperature; Viscosity; Creep; In-mold stress; Injection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information and Computing Science, 2009. ICIC '09. Second International Conference on
  • Conference_Location
    Manchester
  • Print_ISBN
    978-0-7695-3634-7
  • Type

    conf

  • DOI
    10.1109/ICIC.2009.222
  • Filename
    5168805