DocumentCode
494975
Title
Creep Model on Simulating In-mold Stress in Injection Molded Polymers
Author
Wu, Hai-hong ; Sha, Jie ; Liu, Zi-ran
Author_Institution
Coll. of Electromech. Eng., Henan Univ. of Technol., Zhengzhou, China
Volume
3
fYear
2009
fDate
21-22 May 2009
Firstpage
66
Lastpage
69
Abstract
In-mold stress may occur for injection molded parts during the cooling stage. It not only affects the shrinkage of the part, but also has great influence on its mechanical properties. In this paper, stress-strain response was studied under the action of temperature and packing pressure in the process of injection molding. Furthermore, a new model was set to simulate the level of in-mold stresses in injection molded parts, and its creep constitutive equation was obtained. Instead of dealing with viscoelastic parameters of the polymer with WLF equation, the viscous factor was calculated with inversion method and the formula of elastic module was directly derived from P-V-T equation. The in-mold stresses in injection molded plates were simulated with the model. The results revealed that the new approach is reliable and accurate.
Keywords
creep; elastic moduli; injection moulding; polymers; shrinkage; stress-strain relations; viscoelasticity; P-V-T equation; WLF equation; creep modelling; elastic modulus; injection moulding; inmold stress; packing pressure; polymers; shrinkage; stress-strain response; viscoelastic parameters; Cooling; Creep; Elasticity; Equations; Injection molding; Mechanical factors; Polymers; Stress; Temperature; Viscosity; Creep; In-mold stress; Injection;
fLanguage
English
Publisher
ieee
Conference_Titel
Information and Computing Science, 2009. ICIC '09. Second International Conference on
Conference_Location
Manchester
Print_ISBN
978-0-7695-3634-7
Type
conf
DOI
10.1109/ICIC.2009.222
Filename
5168805
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