DocumentCode
497216
Title
Impact of uniaxial strain on channel backscattering characteristics and drain current variation for nanoscale PMOSFETs
Author
Lee, Wei ; Kuo, Jack J -Y ; Chen, Willian P -N ; Su, Pin ; Jeng, Min-Chie
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2009
fDate
16-18 June 2009
Firstpage
112
Lastpage
113
Abstract
Using an improved temperature-dependent method, this paper clarifies that channel backscattering of nanoscale PMOSFETs can be reduced by the uniaxially compressive strain. For the first time, the electrostatic potential of the source-channel junction barrier has been experimentally characterized with strain and gate voltage dependence. We further demonstrate that the strain technology can improve the drain current variation as well as the mismatching properties through the enhanced ballistic efficiency. Moreover, the improvement shows gate length and drain voltage dependence.
Keywords
MOSFET; compressive strength; electron backscattering; electrostatics; nanoelectronics; channel backscattering; drain current variation; electrostatic potential; nanoscale PMOSFET; source-channel junction barrier; temperature-dependent method; uniaxial compressive strain; Backscatter; MOSFETs; Uniaxial strain;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2009 Symposium on
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4244-3308-7
Type
conf
Filename
5200653
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