DocumentCode
497958
Title
A CMOS accelerometer using bondwire inertial sensing
Author
Liao, Y.-T. ; Biederman, W. ; Otis, B.
Author_Institution
Department of Electrical Engineering, University of Washington, Seattle, 98195, USA
fYear
2009
fDate
16-18 June 2009
Firstpage
64
Lastpage
65
Abstract
This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 µm CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply.
Keywords
Acceleration; Accelerometers; Bonding; Circuits; Frequency; Gold; Inductance; Oscillators; Packaging; Phase locked loops;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Circuits, 2009 Symposium on
Conference_Location
Kyoto, Japan
Print_ISBN
978-1-4244-3307-0
Electronic_ISBN
978-4-86348-001-8
Type
conf
Filename
5205305
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