Title :
Moore´s Law: Another casualty of the financial meltdown?
Author :
Cong, J. ; Nagaraj, N.S. ; Puri, R. ; Joyner, W. ; Burns, J. ; Gavrielov, M. ; Radojcic, R. ; Rickert, P. ; Stork, H.
Author_Institution :
Univ. of California, Los Angeles, Los Angeles, CA, USA
Abstract :
Given the exponential increase of fabrication costs, the global recession and credit crunch, one may ask if Moore´s law is financially viable beyond 22 nm node. Can we justify the return-of-investment (ROI) for continuous scaling beyond 22 nm? Shall we consider other alternatives for integration, such as silicon-in-a-package (SiP) or 3D integrations?
Keywords :
investment; semiconductor industry; Moore´s law; financial meltdown; return-of-investment; silicon-in-a-package; Circuit testing; Costs; Forward contracts; Instruments; Integrated circuit reliability; Moore´s Law; Physics; Power generation; Power generation economics; Technological innovation; Keywords are your own designated keywords;
Conference_Titel :
Design Automation Conference, 2009. DAC '09. 46th ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-6055-8497-3
